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Qualcomm Snapdragon flaws impact Lenovo, Microsoft, Lenovo, and Samsung devices

Tens of software vulnerabilities affected Qualcomm firmware and impacted the devices of Microsoft, Lenovo, and Samsung. Qualcomm January 2023 security bulletin addressed 22 software vulnerabilities in its Snapdragon suite. Some of the flaws were reported by the efiXplorer Team at the firmware protection firm Binarly, Zinuo Han of OPPO Amber Security Lab, Gengjia Chen from […]

Qualcomm Snapdragon

Tens of software vulnerabilities affected Qualcomm firmware and impacted the devices of Microsoft, Lenovo, and Samsung.

Qualcomm January 2023 security bulletin addressed 22 software vulnerabilities in its Snapdragon suite. Some of the flaws were reported by the efiXplorer Team at the firmware protection firm Binarly, Zinuo Han of OPPO Amber Security Lab, Gengjia Chen from IceSword Lab, the researchers nicolas (nicolas1993), Seonung Jang of STEALIEN, and Le Wu of Baidu Security.

Below are reported the most severe vulnerabilities addressed by the company:

Public IDSecurity RatingCVSS RatingTechnology AreaDate Reported
CVE-2022-33218CriticalHighAutomotiveInternal
CVE-2022-33219CriticalCriticalAutomotiveInternal
CVE-2022-33265CriticalHighPowerline Communication FirmwareInternal
CVE-2022-25725HighMediumUTILSInternal
CVE-2022-25746HighHighKERNELInternal
CVE-2022-33252HighHighWLAN FirmwareInternal
CVE-2022-33253HighHighWLAN FirmwareInternal
CVE-2022-33266HighMediumAudioInternal
CVE-2022-33274HighHighAndroid CoreInternal
CVE-2022-33276HighHighWLAN FirmwareInternal
CVE-2022-33283HighHighWLAN FirmwareInternal
CVE-2022-33284HighHighWLAN FirmwareInternal
CVE-2022-33285HighHighWLAN FirmwareInternal
CVE-2022-33286HighHighWLAN FirmwareInternal
CVE-2022-33290HighHighAutomotive ConnectivityInternal
CVE-2022-33299HighHighAutomotive ConnectivityInternal
CVE-2022-33300HighHighAutomotive Android OSInternal
CVE-2022-40516HighHighBoot10/28/2022
CVE-2022-40517HighHighBoot10/28/2022
CVE-2022-40520HighHighConnectivity10/28/2022

The most severe flaw is an integer overflow to buffer overflow in Automotive tracked as CVE-2022-33219 (CVSS Score 9.3).

“Memory corruption in Automotive due to integer overflow to buffer overflow while registering a new listener with shared buffer.” reads the advisory.

Other two severe issues fixed by Qualcomm are:

  • CVE-2022-33218 (CVSS Score 8.2) – the flaw is a Memory corruption in Automotive due to improper input validation.
  • CVE-2022-33265 (CVSS Score 7.3) – the flaw is an Information exposure in Powerline Communication Firmware.

The flaws impacted laptops and other devices using Snapdragon chipsets that are manufactured by Lenovo, Microsoft, and Samsung.

Lenovo released updates to address the vulnerabilities impacting the ThinkPad X13s BIOS.

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Pierluigi Paganini

(SecurityAffairs – hacking, Moshen Dragon)

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